As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
In the near future, semiconductor technology will allow the integration of multiple processors on a chip or multichipmodule (MCM). In this paper we investigate the architecture an...
Character skinning determines how the shape of the surface geometry changes as a function of the pose of the underlying skeleton. In this paper we describe skinning templates, whi...
Tao Ju, Qian-Yi Zhou, Michiel van de Panne, Daniel...
Application-specific system-on-chip platforms create the opportunity to customize the cache configuration for optimal performance with minimal chip estate. Simulation, in partic...
Horizontally Partitioned Caches (HPCs) are a promising architectural feature to reduce the energy consumption of the memory subsystem. However, the energy reduction obtained using...