42 search results - page 1 / 9 » Three-Dimensional Integrated Circuits: Performance, Design M... |
ISVLSI
2003
IEEE
13 years 9 months ago
2003
IEEE
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
ISQED
2002
IEEE
13 years 9 months ago
2002
IEEE
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
ICCD
2005
IEEE
14 years 1 months ago
2005
IEEE
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
DAC
2007
ACM
13 years 8 months ago
2007
ACM
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
ICCD
2005
IEEE
14 years 1 months ago
2005
IEEE
— Since rapid progress has been made in device improvement and integration of small carbon nanotube fieldeffect transistors (CNFETs) circuits, the time has come for developing c...