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» Three-Dimensional Integrated Circuits: Performance, Design M...
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DAC
1999
ACM
14 years 5 months ago
Converting a 64b PowerPC Processor from CMOS Bulk to SOI Technology
A 550MHz 64b PowerPC processor was developed for fabrication in Silicon-On-Insulator (SOI) technology from a processor previously designed and fabricated in bulk CMOS [1]. Both th...
D. Allen, D. Behrends, B. Stanisic
GLVLSI
2005
IEEE
122views VLSI» more  GLVLSI 2005»
13 years 10 months ago
Thermal aware cell-based full-chip electromigration reliability analysis
A hierarchical scheme with cells and modules is crucial for managing design complexity during a large integrated circuit design. We present a methodology for thermal aware cell-ba...
Syed M. Alam, Donald E. Troxel, Carl V. Thompson
EVOW
2000
Springer
13 years 8 months ago
Prediction of Power Requirements for High-Speed Circuits
Modern VLSI design methodologies and manufacturing technologies are making circuits increasingly fast. The quest for higher circuit performance and integration density stems from f...
Fulvio Corno, Maurizio Rebaudengo, Matteo Sonza Re...
ISCAS
2007
IEEE
106views Hardware» more  ISCAS 2007»
13 years 10 months ago
Ensemble Dependent Matrix Methodology for Probabilistic-Based Fault-tolerant Nanoscale Circuit Design
—Two probabilistic-based models, namely the Ensemble-Dependent Matrix model [1][3] and the Markov Random Field model [2], have been proposed to deal with faults in nanoscale syst...
Huifei Rao, Jie Chen, Changhong Yu, Woon Tiong Ang...
DAC
2000
ACM
14 years 5 months ago
Closing the gap between ASIC and custom: an ASIC perspective
We investigate the differences in speed between applicationspecific integrated circuits and custom integrated circuits when each are implemented in the same process technology, wi...
David G. Chinnery, Kurt Keutzer