42 search results - page 9 / 9 » Three-Dimensional Integrated Circuits: Performance, Design M... |
DAC
2012
ACM
11 years 7 months ago
2012
ACM
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
ISLPED
2006
ACM
13 years 10 months ago
2006
ACM
Process variations will increasingly impact the operational characteristics of integrated circuits in nanoscale semiconductor technologies. Researchers have proposed various desig...