This paper presents a unique approach to improve yield given a routed layout. Currently after routing has been completed and compacted, it generally proceeds to verification witho...
We propose in this paper a multilevel full-chip routing algorithm that improves testability and diagnosability, manufacturability, and signal integrity for yield enhancement. Two ...
Future process nodes have such small feature sizes that there will be an increase in the number of manufacturing defects per die. For large FPGAs, it will be critical to tolerate ...
We propose to introduce redundant interconnects for manufacturing yield and reliability improvement. By introducing redundant interconnects, the potential for open faults is reduc...
The ability to improve the yield of integrated circuits through layout modification has been recognized and several techniques for yield enhanced routing and compaction have been ...