8 search results - page 2 / 2 » Using 3D integration technology to realize multi-context FPG... |
FPL
2007
Springer
13 years 11 months ago
2007
Springer
The complexity of today’s embedded applications requires modern high-performance embedded System-on-Chip (SoC) platforms to be multiprocessor architectures. Advances in FPGA tec...
DAC
2006
ACM
13 years 11 months ago
2006
ACM
We present a novel application for carbon nanotube devices, implementing a high density 3-D capacitor, which can be useful for decoupling applications to reduce supply voltage var...
PERCOM
2007
ACM
14 years 4 months ago
2007
ACM
In this paper we present a toolkit for realizing capacitive sensing applications for human-computer interaction in pervasive computing systems. We argue that capacitive sensors - ...