3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Parallel to the societal diffusion of digital technologies, the debate on their impacts and requirements has created terms like ICT literacy, digital literacy or digital competenc...
We address the problem of efficient end-to-end network monitoring of path metrics in communication networks. Our goal is to minimize the number of measurements or monitors requir...
- Mobile agents have the ability to migrate through heterogeneous networks and execute at remote hosts. This ability can be exploited to improve the performance of agent based appl...