Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
Due to the shrinking of feature size and reduction in supply voltages, nanoscale circuits have become more susceptible to radiation induced transient faults. In this paper, we pre...
Networks-on-Chip (NoC) architectures provide a scalable solution to on-chip communication problem but the bandwidth offered by NoCs can be utilized efficiently only in presence of...
In a placed circuit, there are a lot of movable cells that can be flipped to further reduce the total wirelength, without affecting the original placement solution. We aim at solv...
Chiu-Wing Sham, Evangeline F. Y. Young, Chris C. N...
Design space exploration during high level synthesis is often conducted through ad-hoc probing of the solution space using some scheduling algorithm. This is not only time consumi...
Gang Wang, Wenrui Gong, Brian DeRenzi, Ryan Kastne...