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ICCAD
2010
IEEE
13 years 3 months ago
2010
IEEE
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
ICCAD
2010
IEEE
13 years 3 months ago
2010
IEEE
In this paper, we propose a new technique, referred to as MultiWafer Virtual Probe (MVP) to efficiently model wafer-level spatial variations for nanoscale integrated circuits. Tow...
ICCAD
2010
IEEE
13 years 3 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
ICCAD
2010
IEEE
13 years 3 months ago
2010
IEEE
Abstract--We present a methodology for implementing digital signal processing (DSP) operations such as filtering with biomolecular reactions. From a DSP specification, we demonstra...
ICCAD
2010
IEEE
13 years 3 months ago
2010
IEEE
1In this paper, we will present an effective layout method for analog circuits. We consider symmetry constraint, common centroid constraint, device merging and device clustering du...