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    ICCD
    2005
    IEEE
    221views Hardware» more  ICCD 2005»
    Broadband Impedance Matching for Inductive Interconnect in VLSI Packages
    14 years 2 months ago
    Broadband Impedance Matching for Inductive Interconnect in VLSI Packages
    Download  www.coe.montana.edu
    Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
    Brock J. LaMeres, Sunil P. Khatri
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    ICCD
    2005
    IEEE
    176views Hardware» more  ICCD 2005»
    A Formal Framework for Modeling and Analysis of System-Level Dynamic Power Management
    14 years 2 months ago
    A Formal Framework for Modeling and Analysis of System-Level Dynamic Power Management
    Download  computing.ece.vt.edu
    Recent advances in Dynamic Power Management (DPM) techniques have resulted in designs that support a rich set of power management options, both at the hardware and software levels...
    Shrirang M. Yardi, Karthik Channakeshava, Michael ...
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