26 search results - page 1 / 6 » ics 2011 |
ECCTD
2011
12 years 4 months ago
2011
Abstract—The design of integrated circuits involves the consideration of a large number of constraints of various types. In addition to the definition of these constraints in a ...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
ICASSP
2011
IEEE
12 years 8 months ago
2011
IEEE
This work studies distributed linear transmission strategies for the multiple-input multiple-output (MIMO) interference channel with multiple concurrent links. We introduce the no...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
TCAD
2011
12 years 11 months ago
2011
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...