31 search results - page 1 / 7 » pads 2009 |
ACISP
2009
Springer
13 years 11 months ago
2009
Springer
ICCAD
2009
IEEE
13 years 2 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
ICRA
2009
IEEE
13 years 11 months ago
2009
IEEE
— Most of robotic soft pads studied so far were made with a thick layer of homogeneous material shaped around a rigid core; their behavior has been widely investigated in the lit...
ASPDAC
2009
ACM
13 years 11 months ago
2009
ACM
Abstract— In an effort to make processors more power efficient scratch pad memory (SPM) have been proposed instead of caches, which can consume majority of processor power. Howe...
DAC
2009
ACM
14 years 5 months ago
2009
ACM
In this paper, we present a novel flip-chip routing algorithm for package-board co-design. Unlike the previous works that can consider only either free- or pre-assignment routing,...