Sciweavers

ICPP
2007
IEEE
13 years 11 months ago
Tightly-Coupled Multi-Layer Topologies for 3-D NoCs
Three-dimensional Network-on-Chip (3-D NoC) is an emerging research topic exploring the network architecture of 3-D ICs that stack several smaller wafers for reducing wire length ...
Hiroki Matsutani, Michihiro Koibuchi, Hideharu Ama...