Sciweavers

ISQED
2007
IEEE
236views Hardware» more  ISQED 2007»
13 years 10 months ago
3DFFT: Thermal Analysis of Non-Homogeneous IC Using 3D FFT Green Function Method
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
Dongkeun Oh, Charlie Chung-Ping Chen, Yu Hen Hu