3DIC
2009
IEEE
13 years 7 months ago
2009
IEEE
This paper presents an analysis and comparison between synchronous and delay-insensitive asynchronous logic circuits on thermal distributions for investigating novel solutions to t...
3DIC
2009
IEEE
13 years 7 months ago
2009
IEEE
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...
3DIC
2009
IEEE
13 years 9 months ago
2009
IEEE
This paper investigates the effect of the TSV resistance (RTSV) on the performance of boost converters for Solid State Drive (SSD) using circuit simulation. When RTSV is 0Ω, both ...
3DIC
2009
IEEE
13 years 9 months ago
2009
IEEE
- In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrica...
3DIC
2009
IEEE
13 years 9 months ago
2009
IEEE
Several forms of processor memory organizations have been in use to optimally access off-chip memory systems mainly the Hard disk drives (HDD). Recent trends show that the solid s...
3DIC
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
3DIC
2009
IEEE
13 years 11 months ago
2009
IEEE
—A high-sensitivity capacitive-coupling interface is presented for wireless wafer testing systems. The transmitter is a buffer that drives the transmitter pad, and the receiver c...
3DIC
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
3DIC
2009
IEEE
13 years 11 months ago
2009
IEEE
3DIC
2009
IEEE
13 years 11 months ago
2009
IEEE
The first memristor, originally theorized by Dr. Leon Chua in 1971, was identified by a team at HP Labs in 2008. This new fundamental circuit element is unique in that its resis...