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3DIC
2009
IEEE
178views Hardware» more  3DIC 2009»
11 years 10 months ago
Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs
This paper presents an analysis and comparison between synchronous and delay-insensitive asynchronous logic circuits on thermal distributions for investigating novel solutions to t...
Brent Hollosi, Tao Zhang, Ravi Sankar Parameswaran...
3DIC
2009
IEEE
263views Hardware» more  3DIC 2009»
11 years 10 months ago
3D optical networks-on-chip (NoC) for multiprocessor systems-on-chip (MPSoC)
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...
Yaoyao Ye, Lian Duan, Jiang Xu, Jin Ouyang, Mo Kwa...
3DIC
2009
IEEE
106views Hardware» more  3DIC 2009»
11 years 11 months ago
Effect of resistance of TSV's on performance of boost converter for low power 3D SSD with NAND flash memories
This paper investigates the effect of the TSV resistance (RTSV) on the performance of boost converters for Solid State Drive (SSD) using circuit simulation. When RTSV is 0Ω, both ...
Tadashi Yasufuku, Koichi Ishida, Shinji Miyamoto, ...
3DIC
2009
IEEE
142views Hardware» more  3DIC 2009»
11 years 11 months ago
Electrical-thermal co-analysis for power delivery networks in 3D system integration
- In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrica...
Jianyong Xie, Daehyun Chung, Madhavan Swaminathan,...
3DIC
2009
IEEE
169views Hardware» more  3DIC 2009»
11 years 11 months ago
3-D memory organization and performance analysis for multi-processor network-on-chip architecture
Several forms of processor memory organizations have been in use to optimally access off-chip memory systems mainly the Hard disk drives (HDD). Recent trends show that the solid s...
Awet Yemane Weldezion, Zhonghai Lu, Roshan Weerase...
3DIC
2009
IEEE
153views Hardware» more  3DIC 2009»
12 years 1 months ago
Junction-level thermal extraction and simulation of 3DICs
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
3DIC
2009
IEEE
258views Hardware» more  3DIC 2009»
12 years 1 months ago
A capacitive coupling interface with high sensitivity for wireless wafer testing
—A high-sensitivity capacitive-coupling interface is presented for wireless wafer testing systems. The transmitter is a buffer that drives the transmitter pad, and the receiver c...
Gil-Su Kim, Makoto Takamiya, Takayasu Sakurai
3DIC
2009
IEEE
279views Hardware» more  3DIC 2009»
12 years 1 months ago
Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, ...
3DIC
2009
IEEE
138views Hardware» more  3DIC 2009»
12 years 1 months ago
Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits
Chang-Lee Chen, D.-R. Yost, Jeffrey M. Knecht, Dav...
3DIC
2009
IEEE
184views Hardware» more  3DIC 2009»
12 years 1 months ago
Architectural evaluation of 3D stacked RRAM caches
The first memristor, originally theorized by Dr. Leon Chua in 1971, was identified by a team at HP Labs in 2008. This new fundamental circuit element is unique in that its resis...
Dean L. Lewis, HsienHsin S. Lee
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