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    ISVLSI
    2007
    IEEE
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    Impact of Process Variations on Carbon Nanotube Bundle Interconnect for Future FPGA Architectures
    13 years 10 months ago
    Impact of Process Variations on Carbon Nanotube Bundle Interconnect for Future FPGA Architectures
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    As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alter...
    Soumya Eachempati, Narayanan Vijaykrishnan, Arthur...
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