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ASPDAC
2012
ACM
238views Hardware» more  ASPDAC 2012»
12 years 19 days ago
Design for manufacturability and reliability for TSV-based 3D ICs
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
ASPDAC
2012
ACM
288views Hardware» more  ASPDAC 2012»
12 years 19 days ago
Automatic timing granularity adjustment for host-compiled software simulation
—Host-compiled simulation has been widely adopted as a practical approach for fast and high-level evaluation of complex software-intensive systems at early stages of the design p...
Parisa Razaghi, Andreas Gerstlauer