DAC
2005
ACM
13 years 6 months ago
2005
ACM
Spatially distributed 3D circuit models are extracted with a segmentto-segment BEM (Boundary Element Method) algorithm for both capacitance and inverse inductance couplings rather...
ASPDAC
2005
ACM
13 years 6 months ago
2005
ACM
Abstract— As VLSI technology enters the ultra-deep submicron era, wire coupling capacitance starts to dominate self capacitance and can no longer be neglected in timing driven ro...
ASPDAC
2007
ACM
13 years 8 months ago
2007
ACM
DAC
1999
ACM
13 years 8 months ago
1999
ACM
As the CMOS technology enters the deep submicron design era, the lateral inter-wire coupling capacitance becomes the dominant part of load capacitance and makes RC delay on the bu...
GLVLSI
2005
IEEE
13 years 10 months ago
2005
IEEE
This paper discusses interconnect capacitance extraction for system LCD circuits, where coupling capacitance is much significant since a ground plane locates far away unlike LSI ...
ISQED
2006
IEEE
13 years 10 months ago
2006
IEEE
It is well known that fill insertion adversely affects total and coupling capacitance of interconnects. While grounded fill can be extracted by full-chip extractors, floating ...