Sciweavers

    ICIP
    2007
    IEEE
    129views Image Processing» more  ICIP 2007»
    Automated Solder Inspection Method by Means of X-ray Oblique Computed Tomography
    13 years 11 months ago
    Automated Solder Inspection Method by Means of X-ray Oblique Computed Tomography
    Download  www.fjt.info.gifu-u.ac.jp
    High-density LSI packages such as ball grid array (BGA) are being utilised in the car electronics and communications infrastructure products. These products require a high-speed a...
    Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Ts...
    claim paper
    Read More »
    Explore & Download
    Proceedings Preprints Top 5 Ranked Papers Publications Books Software Tutorials Presentations Lectures Notes Datasets
    Productivity Tools
    International On-screen Keyboard Graphical Social Symbols OCR Text Recognition CSS3 Style Generator Web Page to PDF Web Page to Image PDF Split PDF Merge Latex Equation Editor Sci2ools
    Document Tools
    PDF to Text PDF to Postscript PDF to Thumbnails Excel to PDF Word to PDF Postscript to PDF PowerPoint to PDF Latex to Word Repair Corrupted PDF
    Image Tools
    JPG to PS JPG to PDF Extract Images from PDF Image Converter
    Sciweavers
    About Community Cookies Privacy Policy Terms of Use

    Copyright © Sciweavers LLC, 2009-2024, USA.