ECRTS
2009
IEEE
13 years 2 months ago
2009
IEEE
Multicore architectures, which have multiple processing units on a single chip, have been adopted by most chip manufacturers. Most such chips contain on-chip caches that are share...
TPDS
2010
13 years 2 months ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
TPDS
2008
13 years 4 months ago
2008
It is widely accepted that transient failures will appear more frequently in chips designed in the near future due to several factors such as the increased integration scale. On th...
BMCBI
2005
13 years 4 months ago
2005
Background: Microscopists are familiar with many blemishes that fluorescence images can have due to dust and debris, glass flaws, uneven distribution of fluids or surface coatings...
MR
2006
13 years 4 months ago
2006
This paper deals with placing chips on an MCM substrate in chip array style for minimizing the system failure rate. The placement procedure begins with constructing an initial pla...
BMCBI
2006
13 years 4 months ago
2006
Background: High density oligonucleotide tiling arrays are an effective and powerful platform for conducting unbiased genome-wide studies. The ab initio probe selection method emp...
BMCBI
2006
13 years 4 months ago
2006
Background: Gene expression microarray experiments are expensive to conduct and guidelines for acceptable quality control at intermediate steps before and after the samples are hy...
CORR
2008
Springer
13 years 4 months ago
2008
Springer
The fabrication and experimental characterization of a thermal flow meter, capable of detecting and measuring two independent gas flows with a single chip, is described. The device...
BMCBI
2008
13 years 4 months ago
2008
Background: Recent genome wide transcription factor binding site or chromatin modification mapping analysis techniques, such as chromatin immunoprecipitation (ChIP) linked to DNA ...
FPL
2008
Springer
13 years 6 months ago
2008
Springer
Abstract-The network on chip will become a future general purpose interconnect for FPGAs much like today's standard OPB or PLB bus architectures. However, performance characte...