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    CLEIEJ
    2010
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    3D-Via Driven Partitioning for 3D VLSI Integrated Circuits
    13 years 1 months ago
    3D-Via Driven Partitioning for 3D VLSI Integrated Circuits
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    A 3D circuit is the stacking of regular 2D circuits. The advances on the fabrication and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. Howeve...
    Sandro Sawicki, Gustavo Wilke, Marcelo O. Johann, ...
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