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    DATE
    2007
    IEEE
    86views Hardware» more  DATE 2007»
    Thermally robust clocking schemes for 3D integrated circuits
    13 years 11 months ago
    Thermally robust clocking schemes for 3D integrated circuits
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    3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....
    Mosin Mondal, Andrew J. Ricketts, Sami Kirolos, Ta...
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