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    VLSID
    2009
    IEEE
    144views VLSI» more  VLSID 2009»
    Exploring Carbon Nanotube Bundle Global Interconnects for Chip Multiprocessor Applications
    14 years 5 months ago
    Exploring Carbon Nanotube Bundle Global Interconnects for Chip Multiprocessor Applications
    Download  www.engr.colostate.edu
    The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
    Sudeep Pasricha, Nikil Dutt, Fadi J. Kurdahi
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