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DATE
2010
IEEE
110views Hardware» more  DATE 2010»
13 years 9 months ago
An RDL-configurable 3D memory tier to replace on-chip SRAM
—In a conventional SoC designs, on-chip memories occupy more than the 50% of the total die area. 3D technology enables the distribution of logic and memories on separate stacked ...
Marco Facchini, Paul Marchal, Francky Catthoor, Wi...