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SCSC
2007
13 years 6 months ago
Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging
— The problem of concurrent thermal and vibration loading has not been thoroughly studied even though it is common in electronic packaging applications. Here we attempt to addres...
Cemal Basaran, Juan Gomez, Minghui Lin, Shidong Li
ICCS
2007
Springer
13 years 8 months ago
Multi-level Coupling of Dynamic Data-Driven Experimentation with Material Identification
Abstract. We describe a dynamic data-driven methodology that is capable of simultaneously determining both the parameters of a constitutive model associated with the response of a ...
John Michopoulos, Tomonari Furukawa
FBIT
2007
IEEE
13 years 11 months ago
An Efficient Soft Tissue Characterization Method for Haptic Rendering of Soft Tissue Deformation in Medical Simulation
The modeling of soft tissue behavior is essential in haptic rendering for virtual reality based medical simulators, which provide a safe and objective medium for training medical ...
Bummo Ahn, Jung Kim