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ASPDAC
2007
ACM
122views Hardware» more  ASPDAC 2007»
13 years 9 months ago
Predicting the Performance and Reliability of Carbon Nanotube Bundles for On-Chip Interconnect
Single-walled carbon nanotube (SWCNT) bundles have the potential to provide an attractive solution for the resistivity and electromigration problems faced by traditional copper int...
Arthur Nieuwoudt, Mosin Mondal, Yehia Massoud
ISPD
2000
ACM
86views Hardware» more  ISPD 2000»
13 years 9 months ago
Simulating frequency-dependent current distribution for inductance modeling of on-chip copper interconnects
500+ MHz designs using deep-submicron (DSM) copper interconnects require accurate and efficient modeling of cladding-metals’ frequency-dependent impedance [1]. In this paper, fo...
Li-Fu Chang, Keh-Jeng Chang, Robert Mathews