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DAC
2011
ACM
8 years 5 months ago
Enabling system-level modeling of variation-induced faults in networks-on-chips
Process Variation (PV) is increasingly threatening the reliability of Networks-on-Chips. Thus, various resilient router designs have been recently proposed and evaluated. However,...
Konstantinos Aisopos, Chia-Hsin Owen Chen, Li-Shiu...
DAC
2011
ACM
8 years 5 months ago
Characterizing within-die and die-to-die delay variations introduced by process variations and SOI history effect
Variations in delay caused by within-die and die-to-die process variations and SOI history effect increase timing margins and reduce performance. In order to develop mitigation te...
Jim Aarestad, Charles Lamech, Jim Plusquellic, Dhr...
DAC
2011
ACM
8 years 5 months ago
Enforcing architectural contracts in high-level synthesis
We present a high-level synthesis technique that takes as input two orthogonal descriptions: (a) a behavioral architectural contract between the implementation and the user, and (...
Nikhil A. Patil, Ankit Bansal, Derek Chiou
DAC
2011
ACM
8 years 5 months ago
Single-molecule electronic detection using nanoscale field-effect devices
Traditionally, biomolecular systems have been studied in ensemble. While much can be determined with ensemble measurements, scientific and technological interest is rapidly moving...
Sebastian Sorgenfrei, Kenneth L. Shepard
DAC
2011
ACM
8 years 5 months ago
Fault-tolerant 3D clock network
Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...
Chiao-Ling Lung, Yu-Shih Su, Shih-Hsiu Huang, Yiyu...
DAC
2011
ACM
8 years 5 months ago
Synchronous sequential computation with molecular reactions
Just as electronic systems implement computation in terms of voltage (energy per unit charge), molecular systems compute in terms of chemical concentrations (molecules per unit vo...
Hua Jiang, Marc D. Riedel, Keshab K. Parhi
DAC
2011
ACM
8 years 5 months ago
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
DAC
2011
ACM
8 years 5 months ago
Fast non-monte-carlo transient noise analysis for high-precision analog/RF circuits by stochastic orthogonal polynomials
Stochastic device noise has become a significant challenge for high-precision analog/RF circuits, and it is particularly difficult to correctly include both white noise and flic...
Fang Gong, Hao Yu, Lei He
DAC
2011
ACM
8 years 5 months ago
Image quality aware metrics for performance specification of ADC array in 3D CMOS imagers
A three-dimensional (3D) CMOS imager constructed from stacking a pixel array of image sensors, an analog-to-digital converter (ADC) array, and an image signal processor (ISP) arra...
Hsiu-Ming Chang, Kwang-Ting (Tim) Cheng
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