DAC
2011
ACM
12 years 4 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
Technology scaling allows the integration of billions of transistors on the same die but CAD tools struggle in keeping up with the increasing design complexity. Design productivit...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
In this paper, a new sparse approximation technique is proposed for incremental power grid analysis. Our proposed method is motivated by the observation that when a power grid net...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
Today’s multiprocessor system-on-a-chip (MPSoC) products typically have multiple execution modes, and for each mode, all the products utilize the same task allocation and schedu...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
This paper presents a simulation toolset for estimating the impact of Trusted Platform Modules (TPMs) on the performance of applications that use TPM services, especially in multi...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
In the era of deep sub-wavelength lithography for nanometer VLSI designs, manufacturability and yield issues are critical and need to be addressed during the key physical design i...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
Flash memory is quickly becoming a common component in computer systems ranging from music players to mission-critical server systems. As flash plays a more important role, data ...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
We study the problem on how to maximize the throughput for a periodic real-time system under the given peak temperature constraint. We assume that different tasks in our system ma...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
As transistor dimensions continue to scale deep into the nanometer regime, silicon reliability is becoming a chief concern. At the same time, transistor counts are scaling up, ena...