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3DIC
2009
IEEE
153views Hardware» more  3DIC 2009»
13 years 10 months ago
Junction-level thermal extraction and simulation of 3DICs
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...