DAC
2012
ACM
11 years 7 months ago
2012
ACM
We develop a projected-subgradient primal-dual Lagrange optimization for global placement, that can be instantiated with a variety of interconnect models. It decomposes the origin...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
Variations in delay caused by within-die and die-to-die process variations and SOI history effect increase timing margins and reduce performance. In order to develop mitigation te...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
In the era of deep sub-wavelength lithography for nanometer VLSI designs, manufacturability and yield issues are critical and need to be addressed during the key physical design i...
ICS
2011
Tsinghua U.
12 years 8 months ago
2011
Tsinghua U.
Suppose one is considering purchase of a computer equipped with accelerators. Or suppose one has access to such a computer and is considering porting code to take advantage of the...
DAC
2005
ACM
13 years 6 months ago
2005
ACM
Methodology, EDA Flow, scripts, and documentation plays a tremendous role in the deployment and standardization of advanced design techniques. In this paper we focus not only on l...