ICCAD
2009
IEEE
13 years 2 months ago
2009
IEEE
Dramatic progress has been made in algorithms for placement and routing over the last 5 years, with improvements in both speed and quality. Combining placement and routing into a ...
ASPDAC
2005
ACM
13 years 6 months ago
2005
ACM
- Redundant via insertion is a good solution to reduce the yield loss by via failure. However, the existing methods are all post-layout optimizations that insert redundant via afte...
ISPD
1997
ACM
13 years 8 months ago
1997
ACM
We present results which show that a separate global and detailed routing strategy can be competitive with a combined routing process. Under restricted architectural assumptions, ...
ASPDAC
1998
ACM
13 years 8 months ago
1998
ACM
— This article describes an algorithm for curvilinear detailed routing. We significantly improved the average time performance of Gao’s algorithm by resolving its bottleneck r...
ASPDAC
2004
ACM
13 years 10 months ago
2004
ACM
— In ultra-deep submicron technology, crosstalk noise is so severe that crosstalk avoidance merely in detailed routing is not adequate and it has to be considered in earlier desi...
ICCAD
2005
IEEE
14 years 1 months ago
2005
IEEE
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...