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ISQED
2005
IEEE
76views Hardware» more  ISQED 2005»
13 years 10 months ago
Reticle Floorplanning and Wafer Dicing for Multiple Project Wafers
Multi-project wafer having several chips placed on the same reticle to lower mask cost is key to low-volume IC fabrication. In this paper1 , we proposed two MILP models for simult...
Meng-Chiou Wu, Rung-Bin Lin