Sciweavers

Share
DAC
2010
ACM
9 years 4 months ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...
SASP
2008
IEEE
77views Hardware» more  SASP 2008»
9 years 6 months ago
Resource Sharing in Custom Instruction Set Extensions
Abstract—Customised processor performance generally increases as additional custom instructions are added. However, performance is not the only metric that modern systems must ta...
Marcela Zuluaga, Nigel P. Topham
books