Sciweavers

DAC
2006
ACM
14 years 5 months ago
Novel full-chip gridless routing considering double-via insertion
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...
Huang-Yu Chen, Mei-Fang Chiang, Yao-Wen Chang, Lum...