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HIPEAC
2009
Springer
13 years 11 months ago
Adapting Application Mapping to Systematic Within-Die Process Variations on Chip Multiprocessors
Process variations, which lead to timing and power variations across identically-designed components, have been identified as one of the key future design challenges by the semico...
Yang Ding, Mahmut T. Kandemir, Mary Jane Irwin, Pa...