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CPHYSICS
2007
65views more  CPHYSICS 2007»
13 years 3 months ago
Plasma etching and feature evolution of organic low-k material by using VicAddress
Plasma process is a highly selective technique exploiting the individual or mixed function of positive ions, electrons, neutral radicals, and photons produced by low temperature p...
T. Makabe, T. Shimada, T. Yagisawa
CORR
2008
Springer
194views Education» more  CORR 2008»
13 years 3 months ago
Fabrication of 3D Packaging TSV using DRIE
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
M. Puech, Jean-Marc Thevenoud, J. M. Gruffat, N. L...
CORR
2008
Springer
54views Education» more  CORR 2008»
13 years 3 months ago
Profile Control of a Borosilicate-Glass Groove Formed by Deep Reactive Ion Etching
Deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove are reported. DRIE was carried out using an anodically bonded silicon wafer as an et...
T. Akashi, Y. Yoshimura