ETS
2010
IEEE
13 years 3 months ago
2010
IEEE
ÑIn this paper, we present a comparative study on the effects of resistive-bridging defects in the SRAM core-cells, considering different technology nodes. In particular, we analy...
ETS
2010
IEEE
13 years 3 months ago
2010
IEEE
— A new method is presented to test dynamic parameters of Analogue-to-Digital Converters (ADC). A noisy and nonlinear pulse is applied as the test stimulus, which is suitable for...
ETS
2010
IEEE
13 years 5 months ago
2010
IEEE
This paper explores the concept of design diversity redundancy applied to mixed-signal (MS) circuit blocks, as a proposal to increase system reliability. Three different implement...
ETS
2010
IEEE
13 years 5 months ago
2010
IEEE
It was shown in the past that ATPG based on the Boolean Satisfiability problem is a beneficial complement to traditional ATPG techniques. Its advantages can be observed especially ...
ETS
2010
IEEE
13 years 5 months ago
2010
IEEE
Testing of 3D stacked ICs (SICs) is becoming increasingly important in the semiconductor industry. In this paper, we address the problem of test architecture optimization for 3D s...
ETS
2010
IEEE
13 years 5 months ago
2010
IEEE
Post-silicon validation and debug, or ensuring that software executes correctly on the silicon of a multi-processor system-on-chip (MPSOC) is complicated, as it involves checking g...