flip chip assembly | Sciweavers

MR
2006

57views Robotics» more MR 2006»

Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading

13 years 5 months ago

Interface reliability issue has become a major concern in developing flip chip assembly. The CTE mismatch between different material layers may induce severe interface delaminatio...

Y. L. Zhang, D. X. Q. Shi, W. Zhou

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ASPDAC
2000
ACM

107views Hardware» more ASPDAC 2000»

Taiwan foundry for system-in-package (SIP)

13 years 9 months ago

Download www.cecs.uci.edu

-- System-In-Package (SIP) is a cost-effective alternative to System-On-Chip (SOC) and chips with embedded memory. The key elements of SIP technology include I/O redistribution, so...

Albert Lin

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