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ICCAD
2007
IEEE
124views Hardware» more  ICCAD 2007»
11 years 28 days ago
3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
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