TCAD
2008
13 years 4 months ago
2008
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures due to the copper cladding process. To improve via yield and reliability, ...
ASPDAC
2006
ACM
13 years 10 months ago
2006
ACM
— Due to its great flexibility, gridless routing is desirable for nanometer circuit designs that use variable wire widths and spacings. Nevertheless, it is much more difficult ...