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    A SVM Based Method to Detect Color Shift Defects in IC Packages
    13 years 6 months ago
    A SVM Based Method to Detect Color Shift Defects in IC Packages
    Download  b2.cvl.iis.u-tokyo.ac.jp
    Automated Visual Inspection (AVI) is an essential part in the manufacturing process of Integrated Circuit (IC) packages. Contamination a common defect type found in IC packages ap...
    R. M. C. B. Ratnayake, Craig Hicks, M. A. Akbari
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