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    SLIP
    2009
    ACM
    146views Computer Networks» more  SLIP 2009»
    Integrated interlayer via planning and pin assignment for 3D ICs
    13 years 10 months ago
    Integrated interlayer via planning and pin assignment for 3D ICs
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    As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
    Xu He, Sheqin Dong, Xianlong Hong, Satoshi Goto
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