Sciweavers

MR
2006

57views Robotics» more MR 2006»

Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading

13 years 5 months ago

Interface reliability issue has become a major concern in developing flip chip assembly. The CTE mismatch between different material layers may induce severe interface delaminatio...

Y. L. Zhang, D. X. Q. Shi, W. Zhou

claim paper

Read More »

Sciweavers

Explore & Download

Productivity Tools

Document Tools

Image Tools

Sciweavers