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MJ
2011
288views Multimedia» more  MJ 2011»
8 years 2 months ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza
ICCAD
2010
IEEE
145views Hardware» more  ICCAD 2010»
8 years 5 months ago
Fuzzy control for enforcing energy efficiency in high-performance 3D systems
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
Mohamed M. Sabry, Ayse Kivilcim Coskun, David Atie...
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