DAC
2012
ACM
11 years 7 months ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
PODS
2012
ACM
11 years 7 months ago
2012
ACM
We show that randomization can lead to significant improvements for a few fundamental problems in distributed tracking. Our basis is the count-tracking problem, where there are k...
ATAL
2011
Springer
12 years 4 months ago
2011
Springer
We present a novel approach to interaction-oriented programming based on declaratively representing communication protocols. Our approach exhibits the following distinguishing fea...