IC3
2009
13 years 2 months ago
2009
In this paper we have worked out on some the complex modeling aspects such as Multi Scale modeling, MATLAB Sugar based modeling and have shown the complexities involved in the anal...
CORR
2008
Springer
13 years 4 months ago
2008
Springer
The Through Silicon Via (TSV) process developed by Silex provides down to 30
CORR
2008
Springer
13 years 4 months ago
2008
Springer
Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level ...
CORR
2008
Springer
13 years 4 months ago
2008
Springer
In RF (Radio Frequency) domain, one of the limitations of using MEMS (Micro Electromechanical Systems) switching devices for medium power applications is RF power. Failure phenomen...
GECCO
2006
Springer
13 years 8 months ago
2006
Springer
An automated design synthesis system based on a multi-objective genetic algorithm (MOGA) has been developed for the optimization of surface-micromachined MEMS devices. A hierarchi...
ITC
2003
IEEE
13 years 9 months ago
2003
IEEE
MEMS processes and components are rapidly changing in device design, processing, and, most importantly, application. This paper will discuss the future challenges faced by the MEM...
CASES
2006
ACM
13 years 10 months ago
2006
ACM
Designers of SoCs with non-digital components, such as analog or MEMS devices, can currently use high-level system design languages, such as SystemC, to model only the digital par...
ICCAD
2006
IEEE
13 years 10 months ago
2006
IEEE
CMOS-MEMS integration can improve the performance of the MEMS (micro-electromechanical systems), allows for smaller packages and leads to a lower packaging and instrumentation cos...
