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CORR
2008
Springer
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13 years 4 months ago
Novel Bonding technologies for wafer-level transparent packaging of MOEMS
Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level ...
Herwig Kirchberger, Paul Lindler, Markus Wimplinge...
CASES
2007
ACM
13 years 8 months ago
Towards understanding architectural tradeoffs in MEMS closed-loop feedback control
Micro-Electro-Mechanical Systems (MEMS) combine lithographically formed mechanical structures with electrical elements to create physical systems that operate on the scale of micr...
Greg Hoover, Forrest Brewer, Timothy Sherwood