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DAC
2011
ACM
10 years 6 months ago
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
BMCBI
2008
132views more  BMCBI 2008»
11 years 6 months ago
Mixture models for analysis of melting temperature data
Background: In addition to their use in detecting undesired real-time PCR products, melting temperatures are useful for detecting variations in the desired target sequences. Metho...
Christoffer Nellåker, Fredrik Uhrzander, Joa...
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