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    No-flow underfill flip chip assembly--an experimental and modeling analysis
    13 years 5 months ago
    No-flow underfill flip chip assembly--an experimental and modeling analysis
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    In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfill: the application and curing of the former can be undertaken b...
    Hua Lu 0003, K. C. Hung, Stoyan Stoyanov, Chris Ba...
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