TPDS
1998
13 years 4 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
JPDC
1998
13 years 4 months ago
1998
This paper presents an optical interconnect model for k-ary n-cube network topologies based on freespace analysis. This model integrates relevant parameters inherent to optics wit...
JPDC
2000
13 years 4 months ago
2000
A new class of interconnection networks, the hypernetworks, has been proposed recently. Hypernetworks are characterized by hypergraphs. Compared with point-to-point networks, they...
ISPAN
1999
IEEE
13 years 8 months ago
1999
IEEE
This paper briefly reviews some of the more popular parallel-computer models
SLIP
2004
ACM
13 years 9 months ago
2004
ACM
Throughput, power consumption, signal integrity, pin count and routing complexity are all increasingly important interconnect issues that the system designer must deal with. Recen...
ISCAS
2005
IEEE
13 years 10 months ago
2005
IEEE
Abstract— Interconnect has become a primary bottleneck in integrated circuit design. As CMOS technology is scaled, it will become increasingly difficult for conventional copper ...
HOTI
2008
IEEE
13 years 10 months ago
2008
IEEE
—We present OCDIMM (Optically Connected DIMM), a CPU-DRAM interface that takes advantage of multiwavelength optical interconnects. We show that OCDIMM has at least three key bene...